Solution

   * Material Management
   * Turnkey/ Consignment
   * PCBA
   * Cable Assembly
   * Prototype
   * Complex Systems
   * Assembly & Configuration
   * In Circuit Test
   * Functional Test
   * Kitting Through Distribution
   * Board Design
   * Engineering Service

Process Capabilities

   * Fully Automated SMD
   * Double Sided SMD & PTH
   * Fine Pitch Placement 0.012 mm\
   * BGA Placement 0.04mm
   * Passive Placement 0201
   * BGA & Fine Pitch Rework
   * No Clean or Water Soluble Paste
   * Electro-Mechanical Systems Assembly
   * Functional Systems Testing
   * Functional Circuit Testing
   * In Circuit Testing
   * Hi Pot Testing
   * IPC A610 class 1, 2 or 3
   * X-ray Inspecting and process control